Diamond lapping slurry

Polycrystalline diamond slurry Grade PDS

Characteristic

• Fine polycrystalline diamond materials.
• Superhigh cutting force and surface finish in the processing of high hardness wafers.
• Different carriers are suitable for different fields.

Specification

Application

• Semiconductor wafer processing: such as sapphire substrate, SiC wafer and sapphire window.
• Ceramic processing: such as zirconia fingerprint identification chip, zirconia ceramic mobile phone back cover and other functional ceramics.
• Metal processing: such as stainless steel, die steel, aluminum alloy and other metal materials.

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Selected fine particle shapes of monocrystalline diamond powder. Strict size control . Unique formulation design for different application fields.

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