|Place of Origin:||Zhengzhou China (Mainland)|
|Diameter:||50 - 200mm|
|Thickness:||10 - 20mm|
|Binding agent:||Metal/resin/vitrified/electroplated bond|
|Packaging:||Shipping box, carton|
Diamond lapping pad is a consolidated diamond lapping tool with special structure. It is prepared by uniformly dispersing diamond powder in organic resin adhesive. It is suitable for processing a variety of hard and brittle materials such as glass, ceramics and semiconductor substrates.
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