Global Supplier of industrial diamond & cBN manufacturing
Harmony Industry Diamond (H.I.D.)
| Place of Origin: | Zhengzhou China (Mainland) |
|---|---|
| Brand Name: | Harmony |
| Certification: | ISO 9001:2015, SGS |
| Model Number: | HID WD |
| Minimum Order Quantity: | 1,000 Carat |
| Price: | Negotiable |
| Packaging Details: | Inner plastic bag, outter carton |
| Delivery Time: | 3-5 days |
| Payment Terms: | T/T, L/C, Western Union, MoneyGram, Paypal |
| Supply Ability: | 15,000,000 Carats per year |
| Model: | Grade HID WD | Size: | 7-14um |
|---|---|---|---|
| Material: | Diamond | Abrasive Type: | Synthetic Diamond, Artificial Diamond |
| Crystal Shape: | Single Crystal | Production Method: | High Pressure High Temperature |
| Hardness: | High Strength | Raw Material: | Zhongnan Company, ZND |
| Color: | Yellow | Shape: | Blocky & Regular |
| Particle Size: | Powder, Grit & Dust | Function: | Surface Finishing |
| Application: | Grinding Lapping & Polishing | Usage: | Heavy Duty Work |
| Source: | Artificial Abrasives | Shipment: | FedEx, EMS, DHL & TNT |
| HS Code: | 71051020.00 | OEM/ODM: | Available |
| High Light: | Metal Bonded Diamond Micron Powder,7-14um Diamond Micron Powder,Diamond Powder For Diamond Wire |
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7-14um Metal Bonded Diamond Micron Powder For Diamond Wire
Description:
It is made of high grade and high strength diamond as raw material, on the basis of conventional diamond powder technology, by carrying out special treatment for the crystal shape and surface purification, particles have features of very clean surface, high toughness, consistent crystal shape, good thermal stability and wear resistance. Through our unique technology of critical oversize elimination and length/width ratio control, the particles also have strictly concentrated PSD, and very high content of effective grinding grits. Besides, a variety of coated products are available, it greatly enhances the retention between diamond particles and the bond, thus to prolong the tool's life and improve the sharpness. It also facilitates heat dissipation within the bond system resulting in longer service life of products.
Micron Size Available for Grade HID-WD (μm)
| 4-6 | 4-8 | 5-10 | 6-12 | 8-12 |
| 8-16 | 10-15 | 10-20 | 12-22 | 15-25 |
| 20-30 | 22-36 | 30-40 | 40-50 | 50-60 |
Particle Size Distribution Specification for Superabrasive Grains
| Size | D10≥(µm) | D50(µm) | D95≤(µm) | Max(µm) | Min(µm) |
| 0-0.25 | 0.1 | 0.170~0.210 | 0.38 | -- | -- |
| 0-0.5 | 0.12 | 0.220~0.280 | 0.51 | --- | -- |
| 0-1 | 0.42 | 0.501~0.580 | 0.795 | 1.156 | 0.375 |
| 0.5-1 | 0.472 | 0.581~0.690 | 1.053 | 1.375 | 0.375 |
| 0.5-1.5 | 0.504 | 0.691~0.871 | 1.298 | 1.945 | 0.375 |
| 0-2 | 0.62 | 0.872~0.985 | 1.542 | 2.312 | 0.446 |
| 1/2 | 0.761 | 0.986~1.224 | 1.894 | 3.27 | 0.63 |
| 0.5-3 | 0.94 | 1.225~1.487 | 2.401 | 3.889 | 0.63 |
| 1/3 | 1.048 | 1.488~1.712 | 2.882 | 4.625 | 0.75 |
| 1.5-3 | 1.169 | 1.713~2.014 | 3.321 | 5.5 | 0.75 |
| 2/3 | 1.392 | 2.015~2.302 | 3.663 | 6.541 | 0.892 |
| 2/4 | 1.644 | 2.303~2.754 | 4.496 | 7.778 | 0.892 |
| 2/5 | 1.803 | 2.755~3.312 | 5.5 | 9.25 | 1.06 |
| 3/6 | 2.448 | 3.313~3.898 | 6.386 | 11 | 1.499 |
| 3/7 | 2.913 | 3.899~4.676 | 7.566 | 13.08 | 1.783 |
| 4/8 | 3.605 | 4.677~5.400 | 8.455 | 15.56 | 2.121 |
| 4/9 | 3.952 | 5.401~6.062 | 9.762 | 18.5 | 2.522 |
| 5/10 | 4.401 | 6.063~6.700 | 10.98 | 18.5 | 2.999 |
| 5/12 | 5.022 | 6.701~7.673 | 12.95 | 22 | 3.566 |
| 6/12 | 5.807 | 7.674~8.549 | 13.97 | 26.16 | 4.241 |
| 7/14 | 6.411 | 8.550~9.483 | 15.13 | 26.16 | 4.241 |
| 8/16 | 7.113 | 9.484~10.78 | 17.82 | 31.11 | 5.044 |
| 8/20 | 8.102 | 10.79~12.56 | 20.6 | 37 | 5.998 |
| 10/20 | 9.186 | 12.57~14.18 | 22.54 | 37 | 7.133 |
| 12/22 | 10.53 | 14.19~16.05 | 24.41 | 44 | 7.133 |
| 12/25 | 12.01 | 16.06~17.65 | 26.61 | 44 | 8.482 |
| 15-25 | 13.32 | 17.66~19.55 | 29.75 | 52.33 | 10.09 |
| 20-30 | 15.04 | 19.56~22.50 | 34.64 | 62.23 | 12 |
| 22-36 | 17.28 | 22.51~26.12 | 39.98 | 74 | 12 |
| 30-40 | 20.11 | 26.13~30.10 | 46.56 | 88 | 14.27 |
| 30-50 | 22.36 | 30.11~34.58 | 52.87 | 88 | 16.96 |
| 36-54 | 25.68 | 34.59~39.00 | 60.94 | 104.7 | 20.17 |
| 40-60 | 29.45 | 39.01~43.20 | 69.86 | 124.5 | 20.17 |
| 50-70 | 32.42 | 43.21~47.50 | 72.65 | 124.5 | 23.99 |
| 54-80 | 36.56 | 47.51~52.50 | 80.74 | 124.5 | 23.99 |
Feature:
- Sharp and blocky crystal shape
- Very clean and purified diamond surface (below 20PPM)
- Concentrated PSD
- High content of effective grinding grits
Diamond is a mineral composed of carbon. It is an allotrope of graphite with a chemical formula of C. It is also the original body of common diamonds. Diamond is the hardest substance naturally occurring in nature. Graphite can form synthetic diamonds under high temperature and high pressure. Diamond has a wide range of uses, such as handicrafts, cutting tools in industry, and it is also a precious gemstone.
Diamonds come in various colors, from colorless to black, with colorless ones being particularly preferred. They can be transparent, translucent or opaque. Many diamonds are yellowish, which is mainly due to impurities in the diamonds. The refractive index of diamond is very high, and the dispersion performance is also very strong, which is why the diamond reflects colorful flashes. Diamond will emit blue-green fluorescence under X-ray irradiation. The primary diamond ore is only produced in the Kimberlite tube or a few lamprophyre rocks. Kimberlite is their parent rock, and diamonds in other places are transported by rivers and glaciers. Diamond is generally granular. If the diamond is heated to 1000°C, it will slowly turn into graphite.
Characteristics:
With our raw materials all from strictly quality-controlled suppliers, we pay more attention to all kinds of product standards to meet various application requirements from customers, such as: basic multiple edge particle feature, above international standard, basic particle contents at upper and lower limits, oversize control, low magnetic, hight surface purify.
Application for Wire Diamond Micron Powder Grade HID WD:
It is designed for producing diamond wire, and it is also widely used for cutting, grinding and polishing hard and brittle materials such as monocrystalline silicon, polycrystalline silicon, sapphire, quartz, semiconductor, liquid crystal glass, magnetic materials, etc.
