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Place of Origin: | Zhengzhou China (Mainland) |
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Brand Name: | Harmony |
Certification: | ISO 9001:2015, SGS |
Model Number: | HID WD |
Minimum Order Quantity: | 1,000 Carat |
Price: | Negotiable |
Packaging Details: | Inner plastic bag, outter carton |
Delivery Time: | 3-5 days |
Payment Terms: | T/T, L/C, Western Union, MoneyGram, Paypal |
Supply Ability: | 15,000,000 Carats per year |
Model: | Grade HID WD | Size: | 5um-60um |
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Material: | Diamond | Abrasive Type: | Artificial Diamond, Synthetic Diamond |
Crystal Shape: | Single Crystal | Production Method: | High Pressure High Temperature |
Hardness: | Superabrasives | Raw Material: | Zhongnan Company, Whirlwind |
Color: | Yellow | Shape: | Blocky & Regular |
Particle Size: | Powder, Grit & Abrasives | Function: | Surface Treatment/Finishing |
Application: | Grinding Lapping & Polishing | Usage: | Heavy Duty Work |
Source: | Artificial Abrasives | Shipment: | FedEx & UPS |
HS Code: | 71051020.00 | OEM/ODM: | Available |
High Light: | Wire Diamond Micron Powder,60% Nickel Coated Diamond Micron Powder,56% Nickel Coated Diamond Powder |
30% 56% 60% Nickel Coated Wire Diamond Micron Powder Single Crystal
Description:
It is made of high grade and high strength diamond as raw material, on the basis of conventional diamond powder technology, by carrying out special treatment for the crystal shape and surface purification, particles have features of very clean surface, high toughness, consistent crystal shape, good thermal stability and wear resistance. Through our unique technology of critical oversize elimination and length/width ratio control, the particles also have strictly concentrated PSD, and very high content of effective grinding grits. Besides, a variety of coated products are available, it greatly enhances the retention between diamond particles and the bond, thus to prolong the tool's life and improve the sharpness. It also facilitates heat dissipation within the bond system resulting in longer service life of products.
Micron Size Available for Grade HID-WD (μm)
4-6 | 4-8 | 5-10 | 6-12 | 8-12 |
8-16 | 10-15 | 10-20 | 12-22 | 15-25 |
20-30 | 22-36 | 30-40 | 40-50 | 50-60 |
Particle Size Distribution Specification for Superabrasive Grains
Size | D10≥(µm) | D50(µm) | D95≤(µm) | Max(µm) | Min(µm) |
0-0.25 | 0.1 | 0.170~0.210 | 0.38 | -- | -- |
0-0.5 | 0.12 | 0.220~0.280 | 0.51 | --- | -- |
0-1 | 0.42 | 0.501~0.580 | 0.795 | 1.156 | 0.375 |
0.5-1 | 0.472 | 0.581~0.690 | 1.053 | 1.375 | 0.375 |
0.5-1.5 | 0.504 | 0.691~0.871 | 1.298 | 1.945 | 0.375 |
0-2 | 0.62 | 0.872~0.985 | 1.542 | 2.312 | 0.446 |
1/2 | 0.761 | 0.986~1.224 | 1.894 | 3.27 | 0.63 |
0.5-3 | 0.94 | 1.225~1.487 | 2.401 | 3.889 | 0.63 |
1/3 | 1.048 | 1.488~1.712 | 2.882 | 4.625 | 0.75 |
1.5-3 | 1.169 | 1.713~2.014 | 3.321 | 5.5 | 0.75 |
2/3 | 1.392 | 2.015~2.302 | 3.663 | 6.541 | 0.892 |
2/4 | 1.644 | 2.303~2.754 | 4.496 | 7.778 | 0.892 |
2/5 | 1.803 | 2.755~3.312 | 5.5 | 9.25 | 1.06 |
3/6 | 2.448 | 3.313~3.898 | 6.386 | 11 | 1.499 |
3/7 | 2.913 | 3.899~4.676 | 7.566 | 13.08 | 1.783 |
4/8 | 3.605 | 4.677~5.400 | 8.455 | 15.56 | 2.121 |
4/9 | 3.952 | 5.401~6.062 | 9.762 | 18.5 | 2.522 |
5/10 | 4.401 | 6.063~6.700 | 10.98 | 18.5 | 2.999 |
5/12 | 5.022 | 6.701~7.673 | 12.95 | 22 | 3.566 |
6/12 | 5.807 | 7.674~8.549 | 13.97 | 26.16 | 4.241 |
7/14 | 6.411 | 8.550~9.483 | 15.13 | 26.16 | 4.241 |
8/16 | 7.113 | 9.484~10.78 | 17.82 | 31.11 | 5.044 |
8/20 | 8.102 | 10.79~12.56 | 20.6 | 37 | 5.998 |
10/20 | 9.186 | 12.57~14.18 | 22.54 | 37 | 7.133 |
12/22 | 10.53 | 14.19~16.05 | 24.41 | 44 | 7.133 |
12/25 | 12.01 | 16.06~17.65 | 26.61 | 44 | 8.482 |
15-25 | 13.32 | 17.66~19.55 | 29.75 | 52.33 | 10.09 |
20-30 | 15.04 | 19.56~22.50 | 34.64 | 62.23 | 12 |
22-36 | 17.28 | 22.51~26.12 | 39.98 | 74 | 12 |
30-40 | 20.11 | 26.13~30.10 | 46.56 | 88 | 14.27 |
30-50 | 22.36 | 30.11~34.58 | 52.87 | 88 | 16.96 |
36-54 | 25.68 | 34.59~39.00 | 60.94 | 104.7 | 20.17 |
40-60 | 29.45 | 39.01~43.20 | 69.86 | 124.5 | 20.17 |
50-70 | 32.42 | 43.21~47.50 | 72.65 | 124.5 | 23.99 |
54-80 | 36.56 | 47.51~52.50 | 80.74 | 124.5 | 23.99 |
Coated diamond and cubic boron nitride is to coat the surface of diamond and cubic boron nitride with a metal layer of specific thickness by electroless plating, electroplating and other methods to improve the bonding ability of diamond, cubic boron nitride and the bond. Enhance the abrasive holding force, cover up the defects of the abrasive, improve the strength of the abrasive particles, and at the same time, the metal coating can isolate the air, improve heat dissipation, reduce the oxidation and thermal damage of diamond and cubic boron nitride, and greatly extend the service life.
When customers use micro-powder in special applications, they often require that the micro-powder be nickel-plated and then used. Because the particles of the micropowder are very small, the particles are very easy to bond during the plating process, which greatly affects the plating quality and use effect. Besco's unique technology solves this problem and enables each particle of the micropowder to play a role in the processing process.
Feature:
Nickel - 30%,56% or 60% by weight, or any customized specification
Copper - 50% by weight or any customized specification
- Used to enhance bond retention, Allows for better heat dissipation
- Can be Customized based on customers' demand
- Sharp and blocky crystal shape
- Very clean and purified diamond surface (below 20PPM)
- Concentrated PSD
- High content of effective grinding grits
Generally speaking, observe the strength and cutting force of the micro powder under a microscope. The flake micro powder has low strength, strong block cutting force and good quality; coarse micro powder is easier to judge, and good micro powder has good transparency when observed under the microscope. , Its core is transparent, surrounded by black contours, bad micropowder, the whole is black; ultra-fine powder refers to the micropowder with a particle size of less than 1.5 μm, which needs to be immersed in cedar oil for observation, magnified by 1600 times, made of conventional glycerin In this way, it is difficult to observe and easy to agglomerate; the quality of ultra-fine powder can be distinguished from the imaging, but it requires more practice and observation.
Characteristics:
With our raw materials all from strictly quality-controlled suppliers, we pay more attention to all kinds of product standards to meet various application requirements from customers, such as: basic multiple edge particle feature, above international standard, basic particle contents at upper and lower limits, oversize control, low magnetic, hight surface purify.
Application for Wire Diamond Micron Powder Grade HID WD:
It is designed for producing diamond wire, and it is also widely used for cutting, grinding and polishing hard and brittle materials such as monocrystalline silicon, polycrystalline silicon, sapphire, quartz, semiconductor, liquid crystal glass, magnetic materials, etc.