Global Supplier of industrial diamond & cBN manufacturing
Harmony Industry Diamond (H.I.D.)
| Place of Origin: | Zhengzhou China (Mainland) |
|---|---|
| Brand Name: | Harmony |
| Certification: | ISO 9001:2015, SGS |
| Model Number: | HID WD |
| Minimum Order Quantity: | 1,000 Carat |
| Price: | Negotiable |
| Packaging Details: | Inner plastic bag, outter carton |
| Delivery Time: | 3-5 days |
| Payment Terms: | T/T, L/C, Western Union, MoneyGram, Paypal |
| Supply Ability: | 15,000,000 Carats per year |
| Model: | Grade HID WD | Size: | 5um-60um |
|---|---|---|---|
| Material: | Diamond | Abrasive Type: | Artificial Diamond, Synthetic Diamond |
| Crystal Shape: | Single Crystal | Production Method: | High Pressure High Temperature |
| Hardness: | Superabrasives | Raw Material: | ZhongNan |
| Color: | Yellow | Shape: | Blocky & Regular |
| Particle Size: | Powder, Grit, Abrasives & Dust | Function: | Surface Treatment |
| Application: | Grinding Lapping & Polishing | Usage: | Heavy Duty Work |
| Source: | Artificial Abrasives | Shipment: | FedEx & UPS |
| HS Code: | 71051020.00 | OEM/ODM: | Available |
| High Light: | Artificial Diamond Micro Powder,ODM Diamond Micro Powder,Wire Synthetic Diamond Grit |
||
ODM Artificial Diamond Micro Powder Wire Synthetic Diamond Grit
Description:
It is made of high grade and high strength diamond as raw material, on the basis of conventional diamond powder technology, by carrying out special treatment for the crystal shape and surface purification, particles have features of very clean surface, high toughness, consistent crystal shape, good thermal stability and wear resistance. Through our unique technology of critical oversize elimination and length/width ratio control, the particles also have strictly concentrated PSD, and very high content of effective grinding grits. Besides, a variety of coated products are available, it greatly enhances the retention between diamond particles and the bond, thus to prolong the tool's life and improve the sharpness. It also facilitates heat dissipation within the bond system resulting in longer service life of products.
Micron Size Available for Grade HID-WD (μm)
| 4-6 | 4-8 | 5-10 | 6-12 | 8-12 |
| 8-16 | 10-15 | 10-20 | 12-22 | 15-25 |
| 20-30 | 22-36 | 30-40 | 40-50 | 50-60 |
Particle Size Distribution Specification for Superabrasive Grains
| Size | D10≥(µm) | D50(µm) | D95≤(µm) | Max(µm) | Min(µm) |
| 0-0.25 | 0.1 | 0.170~0.210 | 0.38 | -- | -- |
| 0-0.5 | 0.12 | 0.220~0.280 | 0.51 | --- | -- |
| 0-1 | 0.42 | 0.501~0.580 | 0.795 | 1.156 | 0.375 |
| 0.5-1 | 0.472 | 0.581~0.690 | 1.053 | 1.375 | 0.375 |
| 0.5-1.5 | 0.504 | 0.691~0.871 | 1.298 | 1.945 | 0.375 |
| 0-2 | 0.62 | 0.872~0.985 | 1.542 | 2.312 | 0.446 |
| 1/2 | 0.761 | 0.986~1.224 | 1.894 | 3.27 | 0.63 |
| 0.5-3 | 0.94 | 1.225~1.487 | 2.401 | 3.889 | 0.63 |
| 1/3 | 1.048 | 1.488~1.712 | 2.882 | 4.625 | 0.75 |
| 1.5-3 | 1.169 | 1.713~2.014 | 3.321 | 5.5 | 0.75 |
| 2/3 | 1.392 | 2.015~2.302 | 3.663 | 6.541 | 0.892 |
| 2/4 | 1.644 | 2.303~2.754 | 4.496 | 7.778 | 0.892 |
| 2/5 | 1.803 | 2.755~3.312 | 5.5 | 9.25 | 1.06 |
| 3/6 | 2.448 | 3.313~3.898 | 6.386 | 11 | 1.499 |
| 3/7 | 2.913 | 3.899~4.676 | 7.566 | 13.08 | 1.783 |
| 4/8 | 3.605 | 4.677~5.400 | 8.455 | 15.56 | 2.121 |
| 4/9 | 3.952 | 5.401~6.062 | 9.762 | 18.5 | 2.522 |
| 5/10 | 4.401 | 6.063~6.700 | 10.98 | 18.5 | 2.999 |
| 5/12 | 5.022 | 6.701~7.673 | 12.95 | 22 | 3.566 |
| 6/12 | 5.807 | 7.674~8.549 | 13.97 | 26.16 | 4.241 |
| 7/14 | 6.411 | 8.550~9.483 | 15.13 | 26.16 | 4.241 |
| 8/16 | 7.113 | 9.484~10.78 | 17.82 | 31.11 | 5.044 |
| 8/20 | 8.102 | 10.79~12.56 | 20.6 | 37 | 5.998 |
| 10/20 | 9.186 | 12.57~14.18 | 22.54 | 37 | 7.133 |
| 12/22 | 10.53 | 14.19~16.05 | 24.41 | 44 | 7.133 |
| 12/25 | 12.01 | 16.06~17.65 | 26.61 | 44 | 8.482 |
| 15-25 | 13.32 | 17.66~19.55 | 29.75 | 52.33 | 10.09 |
| 20-30 | 15.04 | 19.56~22.50 | 34.64 | 62.23 | 12 |
| 22-36 | 17.28 | 22.51~26.12 | 39.98 | 74 | 12 |
| 30-40 | 20.11 | 26.13~30.10 | 46.56 | 88 | 14.27 |
| 30-50 | 22.36 | 30.11~34.58 | 52.87 | 88 | 16.96 |
| 36-54 | 25.68 | 34.59~39.00 | 60.94 | 104.7 | 20.17 |
| 40-60 | 29.45 | 39.01~43.20 | 69.86 | 124.5 | 20.17 |
| 50-70 | 32.42 | 43.21~47.50 | 72.65 | 124.5 | 23.99 |
| 54-80 | 36.56 | 47.51~52.50 | 80.74 | 124.5 | 23.99 |
Feature:
- Sharp and blocky crystal shape
- Very clean and purified diamond surface (below 20PPM)
- Concentrated PSD
- High content of effective grinding grits
Synthetic diamond powder is mainly used in grinding and polishing processes. Users often require the lowest diamond concentration and the fastest cutting speed to obtain the best surface roughness and surface quality of the workpiece. To achieve such a high use effect, high-quality micropowder should be controlled from the following aspects: (1) The strength of the diamond raw material should be high, so that the quality of the micropowder produced is better, and the wear resistance and cutting force are better. Micropowder made of yellow material in the market. The micropowder made of low-tech materials produced by small manufacturers has relatively poor wear resistance and cutting force, that is, the micropowder made of green materials. When polishing hard non-metal materials such as crystal and zircon, fine powder of good quality should be used. Poor quality powder has no cutting force and can not grind off the convex marks on the surface, so it is not easy to polish. (2) The size and content of coarse particles should be strictly controlled. Coarse particles should be controlled within the scope specified by national standards, the less the better. Larger particles are larger than coarse particles, which are likely to cause scratches on the workpiece. This is absolutely not allowed. (3) For particle size distribution, the higher the concentration, the better. (4) The shape of the particles. The fine powder with good roundness has a better effect in polishing. The block, multi-edge, multi-edge, low-magnetic and high-strength fine powder has good application effects in the diamond electroplating wire saw. The general shape of the fine powder, such as strip, Blocks and flakes are relatively sharp, and are mostly used in resin bond grinding wheels.
Characteristics:
With our raw materials all from strictly quality-controlled suppliers, we pay more attention to all kinds of product standards to meet various application requirements from customers, such as: basic multiple edge particle feature, above international standard, basic particle contents at upper and lower limits, oversize control, low magnetic, hight surface purify.
Application for Wire Diamond Micron Powder Grade HID WD:
It is designed for producing diamond wire, and it is also widely used for cutting, grinding and polishing hard and brittle materials such as monocrystalline silicon, polycrystalline silicon, sapphire, quartz, semiconductor, liquid crystal glass, magnetic materials, etc.
