140/170 Resin Bond Mesh Diamond Powder Grade BRD30A For Grinding

140/170 Resin Bond Diamond Powder micro friable multi crystal nano

Description:

Industrial diamond powder is relatively inexpensive to produce and therefore widely used for grinding, lapping and polishing applications. Industrial diamonds are used for the cutting and grinding of very hard materials, for optical devices, such as lasers, for heat dissipation, and for diamond coatings to produce enhanced wear resistance.

BRD series are polycrystalline-like diamond graine, mainly used in resin bond diamond grinding wheels. Harmony Industry Diamond (H.I.D.) boron doped technology largely improve BRD series bond strengh accordingly, elevate bond retention capabilities to crystal. Polycrystalline-like diamond graine is composed of sub-crystals with mosaic structure that provides the graine with irregular shape and rough surface. Polycrystalline-like diamond can keep consistency of self-sharpening and sharp cutting edges.

Available Size of Resin Bond Diamond Powder:

Abrasive Materials Mesh Size Comparison List

Series of Harmony Resin Bond Mesh Diamond Powder

- Resin Bond Diamond Powder Premium Grade BRD30
Description: Light grey color, medium tough and micro-friable multinano-crystal, lower toughness but more friable than BRD 20, good self sharpen ability, premium grade to improve the efficiency.

- Resin Bond Diamond Powder Standard Grade BRD20
Description: Dark green color, medium tough and micro-friable multinano-crystal, irregular sharp, perfect self sharpen ability. Best choice for maintaining grinding performance and tool life.

- Resin Bond Diamond Powder Standard Grade BRD10
Description: Light green color, blocky, the most tough product among RBD series. Widely used for heavy duty application demanding long wheel life.

- Resin Bond Diamond Micron Powder Grade BRM

Description: Resin bond diamond micron powder with light gray color, blocky shape, friable, multicrystalline struture. Size distribution and shape are controlled tightly. RBM offers excellent performances in polishing and lapping glass, ceramics etc.

Optical Properties of Diamond:
- Brilliance diamond has extremely high reflectivity, its reflection critical angle is small, the range of total reflection is wide, light is prone to total reflection, and the amount of reflected light is large, thus producing high brightness.
- Scintillation: The flicker of diamond is flash, that is, the reflection and flash of white light on its surface when the diamond or the light source and the observer move relatively. Colorless, transparent, well-crystallized octahedron or curved poly-shaped diamond, even without cutting and grinding, it can show good flashing light.
- Dispersion or fire: Diamond's diverse crystal faces are like a prism, which can decompose the white light that enters the crystal through refraction, reflection and total reflection into the constituent colors of white light-red, orange, yellow, green, Blue, indigo, purple and other shades.
- Luster: The outstandingly hard, smooth and shiny crystal surface or cleavage surface of corundum has a particularly strong reflection effect on white light, and this very characteristic reflection effect is called diamond luster.

Characteristics:

- Strong cutting force: There are a large number of sharp cutting edges on the surface of particles, and the cutting force can reach 2-4 times that of single crystal diamond powder.
- High polishing accuracy: The cutting edge of single crystal diamond powder is large and hard, which is prone to deep scratches. The cutting edge of polycrystal-like diamond powder is small and its hardness is low. The Ra value of workpiece surface after polishing decreases significantly.
- Strong grip strength: rough surface of particles and stronger bonding with binder can significantly improve grip strength of abrasives in various diamond products and improve service life.

Ti-TTi Comparision of BRD Mesh Series:

Shape Comparision of BRD Mesh Series:

Application for Resin Bond Diamond Powder:

- Precision lapping and polishing of SiC and Al2O3 wafers;
- Grinding and polishing of ceramic materials;
- Precision lapping and polishing of stainless steel, aluminium alloy and other metal materials.