200/230 Resin Bond Mesh Diamond Powder Grade BRD30A For Grinding

HPHT Resin Bond Diamond Powder D76 200/230 Mesh

Description:

Diamond is a simple crystal composed of carbon element formed under high pressure and high temperature conditions in the deep parts of the earth. Diamond is a colorless octahedral crystal whose composition is pure carbon, which is linked by carbon atoms with four-valent bonds. It is the hardest substance known to exist naturally. Since the CC bond in diamond is very strong, all valence electrons participate in the formation of covalent bonds, and there are no free electrons, so the hardness of diamond is very large, the melting point is 6900 degrees Fahrenheit, and the ignition point of diamond in pure oxygen is 720~800℃. It is 850~1000℃ in the air, and it is not conductive.

BRD series are polycrystalline-like diamond graine, mainly used in resin bond diamond grinding wheels. Harmony Industry Diamond (H.I.D.) boron doped technology largely improve BRD series bond strengh accordingly, elevate bond retention capabilities to crystal. Polycrystalline-like diamond graine is composed of sub-crystals with mosaic structure that provides the graine with irregular shape and rough surface. Polycrystalline-like diamond can keep consistency of self-sharpening and sharp cutting edges.

Available Size of Resin Bond Diamond Powder:

Abrasive Materials Mesh Size Comparison List

Series of Harmony Resin Bond Mesh Diamond Powder

- Resin Bond Diamond Powder Premium Grade BRD30
Description: Light grey color, medium tough and micro-friable multinano-crystal, lower toughness but more friable than BRD 20, good self sharpen ability, premium grade to improve the efficiency.

- Resin Bond Diamond Powder Standard Grade BRD20
Description: Dark green color, medium tough and micro-friable multinano-crystal, irregular sharp, perfect self sharpen ability. Best choice for maintaining grinding performance and tool life.

- Resin Bond Diamond Powder Standard Grade BRD10
Description: Light green color, blocky, the most tough product among RBD series. Widely used for heavy duty application demanding long wheel life.

- Resin Bond Diamond Micron Powder Grade BRM

Description: Resin bond diamond micron powder with light gray color, blocky shape, friable, multicrystalline struture. Size distribution and shape are controlled tightly. RBM offers excellent performances in polishing and lapping glass, ceramics etc.

Stability of Diamond
Diamond has stable chemical properties, acid and alkali resistance. It does not interact with concentrated HF, HCl, or HNO3 at high temperatures. It only works in the melt of Na2CO3, NaNO3, KNO3, or when it is boiled with the mixture of K2Cr2O7 and H2SO4. Slightly oxidized; corrodes in high temperature gas of O, CO, CO2, H, Cl, H2O, CH4.
Diamond also has non-magnetic properties, poor electrical conductivity, lipophilic and hydrophobic properties, and triboelectric properties. Only type IIb diamond has good semiconductor properties. According to the difference in nitrogen impurity content and thermal, electrical and optical properties of diamond, diamond can be divided into two types, type I and type II, and further subdivided into four subtypes: Ia, Ib, IIa, and IIb. Type I diamonds, especially Ia subtypes, are common ordinary diamonds, accounting for about 98% of the total natural diamonds. Type I diamonds all contain a certain amount of nitrogen and have good thermal conductivity, poor electrical conductivity and good crystal shape. Type Ⅱ diamond is extremely rare, contains little or almost no nitrogen, has good thermal conductivity and characteristics of curved crystals. Subtype IIb diamond has semi-conductivity. Because of the excellent properties of type II diamond, it is mostly used in space technology and cutting-edge industries.

Characteristics:

- Strong cutting force: There are a large number of sharp cutting edges on the surface of particles, and the cutting force can reach 2-4 times that of single crystal diamond powder.
- High polishing accuracy: The cutting edge of single crystal diamond powder is large and hard, which is prone to deep scratches. The cutting edge of polycrystal-like diamond powder is small and its hardness is low. The Ra value of workpiece surface after polishing decreases significantly.
- Strong grip strength: rough surface of particles and stronger bonding with binder can significantly improve grip strength of abrasives in various diamond products and improve service life.

Ti-TTi Comparision of BRD Mesh Series:

Shape Comparision of BRD Mesh Series:

Application for Resin Bond Diamond Powder:

- Precision lapping and polishing of SiC and Al2O3 wafers;
- Grinding and polishing of ceramic materials;
- Precision lapping and polishing of stainless steel, aluminium alloy and other metal materials.