Global Supplier of industrial diamond & cBN manufacturing
Harmony Industry Diamond (H.I.D.)
| Place of Origin: | Zhengzhou China (Mainland) |
|---|---|
| Brand Name: | Harmony |
| Certification: | ISO 9001:2015, SGS |
| Model Number: | HID PLD |
| Minimum Order Quantity: | 100 Carat |
| Price: | Negotiable |
| Packaging Details: | Plastic Bag, Bottle |
| Delivery Time: | 3-5 days |
| Payment Terms: | T/T, L/C, Western Union, MoneyGram, Paypal |
| Supply Ability: | 15,000,000 Carats per year |
| Model: | HID PLD | Size: | 0-1um To 8-12um Micron |
|---|---|---|---|
| Material: | Diamond | Classification Of Diamond: | Synthetic |
| Shape: | Quasi-polycrystalline | Production Method: | Secondary Treatment Of Ordinary Diamond By Chemical Method |
| Strength: | High Hardness | Raw Material: | Zhongnan Company, Whirlwind |
| Color: | Black | Characteristic: | Sharp Cutting Edges Surface |
| Particle: | Powder, Grit, Dust | Function: | Surface Treatment/Finishing |
| Usage: | High Precision Polishing | Application: | SiC, Al2O3 And Other Chips |
| Source: | Precision Abrasives | Shipment: | UPS, DHL |
| HS Code: | 71051020.00 | OEM/ODM: | Available |
| High Light: | 54um Diamond Micron Powder,4um diamond micron powder,Ceramic polycrystalline diamond powder |
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2-4um to 36-54um Polycrystalline Diamond Micron Powder For Polishing Ceramic
Description:
Polycrystalline Like Diamond has the rough surface, excellent material removal rates and perfect performance of surface finish; Polycrystalline Like Diamond has the distinctive micro-faceted diamond surface that provides small cutting points to drastically reduce the surface roughness of the workpiece, so the unique surface can deliver remarkable material removal rates with the added performance of an excellent surface finish, ideally suited for semiconductor materials and fine finishing processing applications.
A special surface treatment process is adopted to cause a chemical reaction on the surface of the original particles, increase the surface roughness of the diamond particles, and enhance the holding force between the diamond particles and the bonding agent. Improve the self-sharpening and cutting force of the original diamond. And in the cutting and polishing process, it can effectively avoid scratches on the surface of the processed workpiece and improve the polishing accuracy. Mainly recommended for sapphire, SiC, silicon wafer polishing and finishing polishing.
Available Size of Polycrystalline Like Diamond Powder:
| Size | 2-4 | 3-6 | 4-8 | 5-10 | 6-12 | 8-16 | 10-20 | 15-25 | 20-30 | 22-36 | 30-40 | 36-54 |
| HID PLD | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ |
Particle Size Distribution Specification for Superabrasive Grains
| Size | D10≥(µm) | D50(µm) | D95≤(µm) | Max(µm) | Min(µm) |
| 0-0.25 | 0.1 | 0.170~0.210 | 0.38 | -- | -- |
| 0-0.5 | 0.12 | 0.220~0.280 | 0.51 | --- | -- |
| 0-1 | 0.42 | 0.501~0.580 | 0.795 | 1.156 | 0.375 |
| 0.5-1 | 0.472 | 0.581~0.690 | 1.053 | 1.375 | 0.375 |
| 0.5-1.5 | 0.504 | 0.691~0.871 | 1.298 | 1.945 | 0.375 |
| 0-2 | 0.62 | 0.872~0.985 | 1.542 | 2.312 | 0.446 |
| 1/2 | 0.761 | 0.986~1.224 | 1.894 | 3.27 | 0.63 |
| 0.5-3 | 0.94 | 1.225~1.487 | 2.401 | 3.889 | 0.63 |
| 1/3 | 1.048 | 1.488~1.712 | 2.882 | 4.625 | 0.75 |
| 1.5-3 | 1.169 | 1.713~2.014 | 3.321 | 5.5 | 0.75 |
| 2/3 | 1.392 | 2.015~2.302 | 3.663 | 6.541 | 0.892 |
| 2/4 | 1.644 | 2.303~2.754 | 4.496 | 7.778 | 0.892 |
| 2/5 | 1.803 | 2.755~3.312 | 5.5 | 9.25 | 1.06 |
| 3/6 | 2.448 | 3.313~3.898 | 6.386 | 11 | 1.499 |
| 3/7 | 2.913 | 3.899~4.676 | 7.566 | 13.08 | 1.783 |
| 4/8 | 3.605 | 4.677~5.400 | 8.455 | 15.56 | 2.121 |
| 4/9 | 3.952 | 5.401~6.062 | 9.762 | 18.5 | 2.522 |
| 5/10 | 4.401 | 6.063~6.700 | 10.98 | 18.5 | 2.999 |
| 5/12 | 5.022 | 6.701~7.673 | 12.95 | 22 | 3.566 |
| 6/12 | 5.807 | 7.674~8.549 | 13.97 | 26.16 | 4.241 |
| 7/14 | 6.411 | 8.550~9.483 | 15.13 | 26.16 | 4.241 |
| 8/16 | 7.113 | 9.484~10.78 | 17.82 | 31.11 | 5.044 |
| 8/20 | 8.102 | 10.79~12.56 | 20.6 | 37 | 5.998 |
| 10/20 | 9.186 | 12.57~14.18 | 22.54 | 37 | 7.133 |
| 12/22 | 10.53 | 14.19~16.05 | 24.41 | 44 | 7.133 |
| 12/25 | 12.01 | 16.06~17.65 | 26.61 | 44 | 8.482 |
| 15-25 | 13.32 | 17.66~19.55 | 29.75 | 52.33 | 10.09 |
| 20-30 | 15.04 | 19.56~22.50 | 34.64 | 62.23 | 12 |
| 22-36 | 17.28 | 22.51~26.12 | 39.98 | 74 | 12 |
| 30-40 | 20.11 | 26.13~30.10 | 46.56 | 88 | 14.27 |
| 30-50 | 22.36 | 30.11~34.58 | 52.87 | 88 | 16.96 |
| 36-54 | 25.68 | 34.59~39.00 | 60.94 | 104.7 | 20.17 |
| 40-60 | 29.45 | 39.01~43.20 | 69.86 | 124.5 | 20.17 |
| 50-70 | 32.42 | 43.21~47.50 | 72.65 | 124.5 | 23.99 |
| 54-80 | 36.56 | 47.51~52.50 | 80.74 | 124.5 | 23.99 |
Feature:
- Strong cutting force: The particle surface has a large number of sharp cutting edges, and the cutting force can reach 2-4 times that of single crystal diamond powder;
- High polishing accuracy: The cutting edge of single crystal diamond powder particles is large and hard, which is prone to deep scratches. The cutting edge of polycrystalline diamond powder particles is small and the hardness is low. After polishing, the surface Ra value of the workpiece is significantly reduced;
- Strong holding power: The surface of the particles is rough, and the bond is more firmly bonded, which can significantly improve the holding power of abrasives in various diamond products and increase the service life.
Characteristics:
Concentrated particle size distribution
High self-sharpening ability
High grinding efficiency
Uniform crystal size
Long working Life
Cost-effective
High purity
Application for Polycrystalline Like Diamond Powder HID PLD:
- Precision grinding and polishing of SiC, Al2O3 and other wafers;
- Grinding and polishing of ceramic materials;
- Precision grinding and polishing of stainless steel, aluminum alloy and other metal materials
