Global Supplier of industrial diamond & cBN manufacturing
Harmony Industry Diamond (H.I.D.)
| Place of Origin: | Zhengzhou China (Mainland) |
|---|---|
| Brand Name: | Harmony |
| Certification: | ISO 9001:2015, SGS |
| Model Number: | Grade BRD20 |
| Minimum Order Quantity: | 1,000 Carat |
| Price: | Negotiable |
| Packaging Details: | Inner plastic bag, outter carton |
| Delivery Time: | 3-5 days |
| Payment Terms: | T/T, L/C, Western Union, MoneyGram, Paypal |
| Supply Ability: | 15,000,000 Carats per year |
| Model: | Grade BRD20 | Size: | 60/80 - 325/400 Mesh |
|---|---|---|---|
| Material: | Diamond | Type: | Monocrystalline |
| Production Method: | High Pressure High Temperature | Hardness: | Superabrasive |
| Color: | Dark Green | Shape: | Regualr Sharp |
| Particle Size: | Powder, Grit, Grain | Function: | Surface Finishing/Treatment |
| Application: | Heavy Duty Work | Usage: | Polishing, Grind |
| Shipment: | DHL And FedEx | Source: | Artificial Abrasives |
| HS Code: | 71051020.00 | OEM/ODM: | Available |
| High Light: | D252 diamond finishing powder,D46 diamond finishing powder,FEPA Industrial diamond powder |
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Industrial FEPA D46- D252 diamond finishing powder good heat dissipation
Description:
Industrial diamond powder has the characteristics of high thermal stability, high chemical stability, good conductivity, good physical properties (high compressive strength, good heat dissipation, strong corrosion resistance, low thermal expansion rate) and so on. It has high hardness and good wear resistance, and can be widely used for cutting, grinding and drilling. Diamond abrasive powder has high thermal conductivity and good electrical insulation, can be used as a heat sink for semiconductor devices, has excellent light transmission and corrosion resistance, and is widely used in the electronics industry.
BRD series are polycrystalline-like diamond graine, mainly used in resin bond diamond grinding wheels. Harmony Industry Diamond (H.I.D.) boron doped technology largely improve BRD series bond strengh accordingly, elevate bond retention capabilities to crystal. Polycrystalline-like diamond graine is composed of sub-crystals with mosaic structure that provides the graine with irregular shape and rough surface. Polycrystalline-like diamond can keep consistency of self-sharpening and sharp cutting edges.
Available Size of Resin Bond Mesh Diamond Powder:
| US Mesh | 60/80 | 80/100 | 100/120 | 120/140 | 140/170 | 170/200 | 200/230 | 230/270 | 270/325 | 325/400 |
| FEPA | D252 | D181 | D151 | D126 | D107 | D91 | D76 | D64 | D54 | D46 |
| BRD10 | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ |
| BRD20 | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ |
| BRD30 | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ |
| BRD-Ni | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ |
Abrasive Materials Mesh Size Comparison List
| HARMONY | 国际标准 | 欧洲共同体 | 美国 U.S.A | 日本 JAPAN | 理论基准尺寸 | 俄罗斯 RUSSIA | ||||||||
| GB/T6406-1995 | ISO | FEPA | ANIS B74.16-1971 | JIS4130-1988 | Theoretlcal | 9206-80 | ||||||||
| Baslc Size | ||||||||||||||
| Grain No | Grain Size | Grain No Ⅰ | Grain No Ⅱ | Grain Size | Grain No | Grain Size | Grain No | Grain Size | Grain No | Grain Size | Inch | Mlllmeter | Grain No | Grain Size |
| 40/50 | 425/300 | 427 | 40/50 | 425/300 | B/427 | 355/300 | 40/50 | 425/300 | 40/50 | 425/300 | 0.015 | 0.378 | 500/400 | 500/400 |
| 50/60 | 300/250 | 301 | 50/60 | 300/250 | B/301 | 300/250 | 50/60 | 300/250 | 50/60 | 300/250 | 0.011 | 0.288 | 400/315 | 400/315 |
| 60/80 | 250/180 | 252 | 60/80 | 250/180 | B/252 | 250/180 | 60/80 | 250/180 | 60/80 | 250/180 | 0.009 | 0.226 | 250/200 | 250/200 |
| 80/100 | 180/150 | 181 | 80/100 | 180/150 | B/181 | 180/150 | 80/100 | 180/150 | 80/100 | 180/150 | 0.0069 | 0.174 | 200/160 | 200/160 |
| 100/120 | 150/125 | 151 | 100/120 | 150/125 | B/151 | 150/125 | 100/120 | 150/125 | 100/120 | 150/125 | 0.0058 | 0.148 | 160/125 | 160/125 |
| 120/140 | 125/106 | 126 | 120/140 | 125/106 | B/126 | 125/106 | 120/140 | 125/106 | 120/140 | 125/106 | 0.0048 | 0.123 | 125/100 | 125/100 |
| 140/170 | 106/90 | 107 | 140/170 | 106/90 | B/107 | 106/90 | 140/170 | 106/90 | 140/170 | 106/90 | 0.0041 | 0.103 | 100/80 | 100/80 |
| 170/200 | 90/75 | 91 | 170/200 | 90/75 | B/91 | 90/75 | 170/200 | 90/75 | 170/200 | 90/75 | 0.0034 | 0.086 | 80/63 | 80/63 |
| 200/230 | 75/63 | 76 | 200/230 | 75/63 | B/76 | 75/63 | 200/230 | 75/63 | 200/230 | 75/63 | 0.003 | 0.075 | 63/50 | 63/50 |
| 230/270 | 63/53 | 64 | 230/270 | 63/53 | B/64 | 63/53 | 230/270 | 63/53 | 230/270 | 63/53 | 0.0026 | 0.066 | 50/40 | 50/40 |
| 270/325 | 53/45 | 54 | 270/325 | 53/45 | B/54 | 53/45 | 270/325 | 53/45 | 270/325 | 53/45 | 0.0022 | 0.057 | ||
| 325/400 | 45/38 | 46 | 325/400 | 45/38 | B/46 | 45/38 | 325/400 | 45/38 | 325/400 | 45/38 | 0.0019 | 0.048 | ||
Series of Resin Bond Mesh Diamond Powder
- Resin Bond Diamond Premium Grade BRD30
Description: Light grey, medium tough and micro-friable multinano-crystal, lower toughness but more friable than BRD 20, good self sharpen ability, premium grade to improve the efficiency.
- Resin Bond Diamond Standard Grade BRD20
Description: Dark green, medium tough and micro-friable multinano-crystal, irregular sharp, perfect self sharpen ability. Best choice for maintaining grinding performance and tool life.
- Resin Bond Diamond Economic Grade BRD10
Description: Light green, blocky, the most tough product among RBD series. Widely used for heavy duty application demanding long wheel life.
Characteristics:
Strong cutting force: There are a large number of sharp cutting edges on the surface of particles, and the cutting force can reach 2-4 times that of single crystal diamond powder.
High polishing accuracy: The cutting edge of single crystal diamond powder is large and hard, which is prone to deep scratches. The cutting edge of polycrystal-like diamond powder is small and its hardness is low. The Ra value of workpiece surface after polishing decreases significantly.
Strong grip strength: rough surface of particles and stronger bonding with binder can significantly improve grip strength of abrasives in various diamond products and improve service life.
Application for Resin Bond Diamond Powder:
Precision lapping and polishing of SiC and Al2O3 wafers;
Grinding and polishing of ceramic materials;
Precision lapping and polishing of stainless steel, aluminium alloy and other metal materials.
Ti-TTi Comparision of BRD Mesh Series:
Shape Comparision of BRD Mesh Series:
