Global Supplier of industrial diamond & cBN manufacturing
Harmony Industry Diamond (H.I.D.)
| Place of Origin: | Zhengzhou China (Mainland) |
|---|---|
| Brand Name: | Harmony |
| Certification: | ISO 9001:2015, SGS |
| Model Number: | Grade BRM-30C |
| Minimum Order Quantity: | 1,000 Carat |
| Price: | Negotiable |
| Packaging Details: | Inner plastic bag, outter carton |
| Delivery Time: | 3-5 days |
| Payment Terms: | T/T, L/C, Western Union, MoneyGram, Paypal |
| Supply Ability: | 5,000,000 Carats per year |
| Model: | Grade BRM-30C | Micron Size: | 8-16um |
|---|---|---|---|
| Material: | Diamond | Type: | Single Crystal Synthetic Diamond |
| Production Method: | Static High Pressure Catalytic Method | Hardness: | Superabrasive |
| Color: | Gray Red | Shape: | Blocky, Irregular |
| Particle Size: | Friable, Multicrystalline Struture | Function: | Surface Finishing |
| Application: | Heavy Duty Work | Usage: | Polishing, Grind |
| Shipment: | EMS, DHL And TNT | Source: | Artificial Abrasives |
| HS Code: | 7105102000 | OEM/ODM: | Available |
| High Light: | friable Micron Diamond Powder,Gray Red Micron Diamond Powder,8 16um Copper Coated Diamond Powder |
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8-16um Gray Red friable Micron Diamond Powder Copper Coated
Description:
Synthetic diamond powder is mainly used in grinding and polishing processes. Users often require the lowest diamond concentration and the fastest cutting speed to obtain the best surface roughness and surface quality of the workpiece. To achieve such a high use effect, high-quality micropowder should be controlled from the following aspects: (1) The strength of the diamond raw material should be high, so that the quality of the micropowder produced is better, and the wear resistance and cutting force are better. Micropowder made of yellow material in the market. The micropowder made of low-tech materials produced by small manufacturers has relatively poor wear resistance and cutting force, that is, the micropowder made of green materials. When polishing hard non-metal materials such as crystal and zircon, fine powder of good quality should be used. Poor quality powder has no cutting force and can not grind off the convex marks on the surface, so it is not easy to polish. (2) The size and content of coarse particles should be strictly controlled. Coarse particles should be controlled within the scope specified by national standards, the less the better. Larger particles are larger than coarse particles, which are likely to cause scratches on the workpiece. This is absolutely not allowed. (3) For particle size distribution, the higher the concentration, the better. (4) The shape of the particles. The fine powder with good roundness has a better effect in polishing. The block, multi-edge, multi-edge, low-magnetic and high-strength fine powder has good application effects in the diamond electroplating wire saw. The general shape of the fine powder, such as strip, Blocks and flakes are relatively sharp, and are mostly used in resin bond grinding wheels.
Available Size of Resin Bond Micron Diamond Powder:
| Grade | 0-1 | 0-2 | 1-3 | 2-4 | 3-6 | 4-8 | 5-10 | 6-12 | 8-16 | 10-20 | 12-22 | 15-25 | 20-30 | 22-36 | 30-40 | 36-54 | 40-50 | 40-60 |
| BRM | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ |
| BRM-N30 | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ |
Particle Size Distribution Specification for Superabrasive Grains
| Size | D10≥(µm) | D50(µm) | D95≤(µm) | Max(µm) | Min(µm) |
| 0-0.25 | 0.1 | 0.170~0.210 | 0.38 | -- | -- |
| 0-0.5 | 0.12 | 0.220~0.280 | 0.51 | --- | -- |
| 0-1 | 0.42 | 0.501~0.580 | 0.795 | 1.156 | 0.375 |
| 0.5-1 | 0.472 | 0.581~0.690 | 1.053 | 1.375 | 0.375 |
| 0.5-1.5 | 0.504 | 0.691~0.871 | 1.298 | 1.945 | 0.375 |
| 0-2 | 0.62 | 0.872~0.985 | 1.542 | 2.312 | 0.446 |
| 1/2 | 0.761 | 0.986~1.224 | 1.894 | 3.27 | 0.63 |
| 0.5-3 | 0.94 | 1.225~1.487 | 2.401 | 3.889 | 0.63 |
| 1/3 | 1.048 | 1.488~1.712 | 2.882 | 4.625 | 0.75 |
| 1.5-3 | 1.169 | 1.713~2.014 | 3.321 | 5.5 | 0.75 |
| 2/3 | 1.392 | 2.015~2.302 | 3.663 | 6.541 | 0.892 |
| 2/4 | 1.644 | 2.303~2.754 | 4.496 | 7.778 | 0.892 |
| 2/5 | 1.803 | 2.755~3.312 | 5.5 | 9.25 | 1.06 |
| 3/6 | 2.448 | 3.313~3.898 | 6.386 | 11 | 1.499 |
| 3/7 | 2.913 | 3.899~4.676 | 7.566 | 13.08 | 1.783 |
| 4/8 | 3.605 | 4.677~5.400 | 8.455 | 15.56 | 2.121 |
| 4/9 | 3.952 | 5.401~6.062 | 9.762 | 18.5 | 2.522 |
| 5/10 | 4.401 | 6.063~6.700 | 10.98 | 18.5 | 2.999 |
| 5/12 | 5.022 | 6.701~7.673 | 12.95 | 22 | 3.566 |
| 6/12 | 5.807 | 7.674~8.549 | 13.97 | 26.16 | 4.241 |
| 7/14 | 6.411 | 8.550~9.483 | 15.13 | 26.16 | 4.241 |
| 8/16 | 7.113 | 9.484~10.78 | 17.82 | 31.11 | 5.044 |
| 8/20 | 8.102 | 10.79~12.56 | 20.6 | 37 | 5.998 |
| 10/20 | 9.186 | 12.57~14.18 | 22.54 | 37 | 7.133 |
| 12/22 | 10.53 | 14.19~16.05 | 24.41 | 44 | 7.133 |
| 12/25 | 12.01 | 16.06~17.65 | 26.61 | 44 | 8.482 |
| 15-25 | 13.32 | 17.66~19.55 | 29.75 | 52.33 | 10.09 |
| 20-30 | 15.04 | 19.56~22.50 | 34.64 | 62.23 | 12 |
| 22-36 | 17.28 | 22.51~26.12 | 39.98 | 74 | 12 |
| 30-40 | 20.11 | 26.13~30.10 | 46.56 | 88 | 14.27 |
| 30-50 | 22.36 | 30.11~34.58 | 52.87 | 88 | 16.96 |
| 36-54 | 25.68 | 34.59~39.00 | 60.94 | 104.7 | 20.17 |
| 40-60 | 29.45 | 39.01~43.20 | 69.86 | 124.5 | 20.17 |
| 50-70 | 32.42 | 43.21~47.50 | 72.65 | 124.5 | 23.99 |
| 54-80 | 36.56 | 47.51~52.50 | 80.74 | 124.5 | 23.99 |
Feature:
Resin bond diamond micron powder with light gray color, blocky shape, friable, multicrystalline struture. Size distribution and shape are controlled tightly. RBM offers excellent performances in polishing and lapping glass, ceramics etc.
Characteristics:
Strong cutting force: There are a large number of sharp cutting edges on the surface of particles, and the cutting force can reach 2-4 times that of single crystal diamond powder.
High polishing accuracy: The cutting edge of single crystal diamond powder is large and hard, which is prone to deep scratches. The cutting edge of polycrystal-like diamond powder is small and its hardness is low. The Ra value of workpiece surface after polishing decreases significantly.
Strong grip strength: rough surface of particles and stronger bonding with binder can significantly improve grip strength of abrasives in various diamond products and improve service life.
Application for Resin Bond Diamond Powder:
Precision lapping and polishing of SiC and Al2O3 wafers;
Grinding and polishing of ceramic materials;
Precision lapping and polishing of stainless steel, aluminium alloy and other metal materials.
