Global Supplier of industrial diamond & cBN manufacturing
Harmony Industry Diamond (H.I.D.)
| Place of Origin: | Zhengzhou China (Mainland) |
|---|---|
| Brand Name: | Harmony |
| Certification: | ISO 9001:2015, SGS |
| Model Number: | Grade HID A+ |
| Minimum Order Quantity: | 1,000 Carat |
| Price: | Negotiable |
| Packaging Details: | Inner plastic bag, outter carton |
| Delivery Time: | 3-5 days |
| Payment Terms: | T/T, L/C, Western Union, MoneyGram, Paypal |
| Supply Ability: | 15,000,000 Carats per year |
| Model: | Grade HID A+ | Micron Size: | 0.05-60um |
|---|---|---|---|
| Material: | Diamond | Abrasive Type: | Synthetic Diamond |
| Crystal Shape: | Monocrystalline | Production Method: | High Pressure High Temperature |
| Hardness: | Superabrasives | Application Field: | Precision Grinding, Polishing And Lapping |
| Raw Material: | ZhongNan | Color: | Yellow |
| Shape: | Regular, Round | Particle Size: | Grain Powder |
| Function: | Surface Treatment | Usage: | Abrasive Grind, Polishing And Lapping |
| Source: | Artificial Abrasives | Shipment: | FedEx, DHL, UPS |
| HS Code: | 71051020.00 | OEM/ODM: | Available |
| High Light: | single crystal Diamond Micron Powder,30um Diamond Micron Powder,20um single crystal Diamond powder |
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20-30um Single Crystal Diamond Micron Powder For Fine Grinding
Description:
Diamond powder is mainly used for fine grinding, grinding and polishing of non-metallic hard and brittle materials. Generally, 0~0.5 μm to 6~12 μm is used for polishing, 5~10 μm to 12~22 μm is used for grinding, and 20~30 μm is used for coarse grinding. Diamond powder is mainly used in the following four aspects: (1) Direct use to make abrasive paste. It is widely used in the polishing of cutting tools, measuring tools, optical instruments, electronic devices and other precision parts made of cemented carbide, high-alumina ceramics, optical glass, instrument gems, semiconductors and other materials, and its processing roughness can reach mirror surface. (2) It is widely used in the manufacture of precision grinding discs, super precision grinding discs, and electroplating products. (3) Used to manufacture polycrystalline diamond sintered bodies, such as geological and petroleum drill bits, cutting tools, wire drawing dies, etc. (4) Used in the manufacture of grinding fluid and polishing fluid.
Using high-quality diamond as raw material, through our advanced technology of the precise and strict control of diamond particle classification, diamond strength, crystal shape and purity, we have achieved very narrow PSD, consistant crystal shape, extremely high particle surface purity, oversize control, and batch quality consistency.Using high-quality diamond as raw material, through our advanced technology of the precise and strict control of diamond particle classification, diamond strength, crystal shape and purity, we have achieved very narrow PSD, consistant crystal shape, extremely high particle surface purity, oversize control and batch quality consistency.
Size Available & Particle Size Distribution Specification for Superabrasive Grains
| Size | D10≥(µm) | D50(µm) | D95≤(µm) | Max(µm) | Min(µm) |
| 0-0.25 | 0.1 | 0.170~0.210 | 0.38 | -- | -- |
| 0-0.5 | 0.12 | 0.220~0.280 | 0.51 | --- | -- |
| 0-1 | 0.42 | 0.501~0.580 | 0.795 | 1.156 | 0.375 |
| 0.5-1 | 0.472 | 0.581~0.690 | 1.053 | 1.375 | 0.375 |
| 0.5-1.5 | 0.504 | 0.691~0.871 | 1.298 | 1.945 | 0.375 |
| 0-2 | 0.62 | 0.872~0.985 | 1.542 | 2.312 | 0.446 |
| 1/2 | 0.761 | 0.986~1.224 | 1.894 | 3.27 | 0.63 |
| 0.5-3 | 0.94 | 1.225~1.487 | 2.401 | 3.889 | 0.63 |
| 1/3 | 1.048 | 1.488~1.712 | 2.882 | 4.625 | 0.75 |
| 1.5-3 | 1.169 | 1.713~2.014 | 3.321 | 5.5 | 0.75 |
| 2/3 | 1.392 | 2.015~2.302 | 3.663 | 6.541 | 0.892 |
| 2/4 | 1.644 | 2.303~2.754 | 4.496 | 7.778 | 0.892 |
| 2/5 | 1.803 | 2.755~3.312 | 5.5 | 9.25 | 1.06 |
| 3/6 | 2.448 | 3.313~3.898 | 6.386 | 11 | 1.499 |
| 3/7 | 2.913 | 3.899~4.676 | 7.566 | 13.08 | 1.783 |
| 4/8 | 3.605 | 4.677~5.400 | 8.455 | 15.56 | 2.121 |
| 4/9 | 3.952 | 5.401~6.062 | 9.762 | 18.5 | 2.522 |
| 5/10 | 4.401 | 6.063~6.700 | 10.98 | 18.5 | 2.999 |
| 5/12 | 5.022 | 6.701~7.673 | 12.95 | 22 | 3.566 |
| 6/12 | 5.807 | 7.674~8.549 | 13.97 | 26.16 | 4.241 |
| 7/14 | 6.411 | 8.550~9.483 | 15.13 | 26.16 | 4.241 |
| 8/16 | 7.113 | 9.484~10.78 | 17.82 | 31.11 | 5.044 |
| 8/20 | 8.102 | 10.79~12.56 | 20.6 | 37 | 5.998 |
| 10/20 | 9.186 | 12.57~14.18 | 22.54 | 37 | 7.133 |
| 12/22 | 10.53 | 14.19~16.05 | 24.41 | 44 | 7.133 |
| 12/25 | 12.01 | 16.06~17.65 | 26.61 | 44 | 8.482 |
| 15-25 | 13.32 | 17.66~19.55 | 29.75 | 52.33 | 10.09 |
| 20-30 | 15.04 | 19.56~22.50 | 34.64 | 62.23 | 12 |
| 22-36 | 17.28 | 22.51~26.12 | 39.98 | 74 | 12 |
| 30-40 | 20.11 | 26.13~30.10 | 46.56 | 88 | 14.27 |
| 30-50 | 22.36 | 30.11~34.58 | 52.87 | 88 | 16.96 |
| 36-54 | 25.68 | 34.59~39.00 | 60.94 | 104.7 | 20.17 |
| 40-60 | 29.45 | 39.01~43.20 | 69.86 | 124.5 | 20.17 |
| 50-70 | 32.42 | 43.21~47.50 | 72.65 | 124.5 | 23.99 |
| 54-80 | 36.56 | 47.51~52.50 | 80.74 | 124.5 | 23.99 |
Monocrystalline Micron Diamond Powder Series:
- Premium Grade Micron Diamond HID A+
Description: Raw material is adopted from high technology MBD series of high quality diamond, more regular crystal shape with patented technology process, nearly spherical particle shape, more concentrated particle size distribution and low impurity content, very clean particle surface, easy to disperse to various types of vector and combined with various binders solidly.
Application: Suitable for precision grinding of optical glass, optical grinding pills films, optical grinding wheels, precision polishing wafers, precision grinding wheels of silicon materials for sapphire processing, precision machining tools for jade gem processing.
- Standard Grade Micron Diamond HID A
Description: Raw material is adopted from SCD series of high quality diamond, adopts the advanced production technology, combined with the unique particle shaping technology, produced base on international requirements standardization. With regular crystal shape and low impurity content, particle size distribution is in line with national standards.
Application: Traditional sawing, cutting, grinding, grinding, polishing, as well as a specific range of high-precision cutting, grinding, and polishing, can be used as raw materials for various types of diamond tools and diamond paste and slurry.
- Standard Grade Micron Diamond HID B
Description: Using medium strength diamond as raw material, the crystal shape of the product is regular, the impurity content is low, the grinding efficiency is high, and the particle size distribution meets the national standard.
Application: Suitable for ceramic bond abrasives, resin bond abrasives, all kinds of plating tools, grinding paste, grinding fluid.
- Economic Grade Micron Diamond HID G
Description: Raw material is adopted from RVD series of ordinary diamond, adopt the advanced production technology, produce base on international requirements standardization. With the irregular crystal shape, impurity content and particle size distribution is in line with national standards.
Application: Suitable for resin bond abrasive tools, all kinds of electroplating tools, grinding paste and slurry.
Characteristics:
The particle size distribution of the micropowder has a certain effect on the cutting efficiency and grinding roughness of the material. For the fine grinding and polishing process, it is always required that the content of coarse particles in the micropowder should be less, the long particles should be less, the basic particle size content should be high, concentrated, and the particle size composition should be uniform. Especially for the micropowder used for electroplating products, it is required that the micropowder has good isotropy and uniform particle size composition, so that it is easier to control the height of the edge of the micropowder during electroplating, and the product has a good use effect.
Application for Micron Diamond Premium Grade HID A+:
- Traditional gem polishing: single crystal powder or abrasive paste of about 3um is traditionally used
- Raw material for sintering PCD: Micron-sized powder is expanding with the application of PCD tools.
- Grinding and polishing of sapphire wafers: micron to sub-micron, polycrystalline/single crystal polishing liquid is developing rapidly with LED.
- Grinding and polishing of optical fiber connectors: micron to sub-micron, polishing film.
- Ceramic processing: single crystal or polycrystalline powder can be used. For example, fiber ceramic ferrule: single crystal powder from micron to sub-micron, application products include grinding wheel, grinding fluid, polishing film. The application prospects in this area are good.
- Magnetic head: such as grinding and polishing of GMR magnetic head, submicron ~ nanometer, polishing liquid/polishing film.
- Grinding and polishing of super-hard metal rollers or devices: micron to sub-micron, polishing film/abrasive paste/grinding wheel develops steadily.
- Polishing of metal molds: micron to sub-micron, diamond polishing liquid/grinding paste is developing steadily.
- Raw materials for various grinding tools: single crystals of various grain sizes, there is still broad room for development!
