Global Supplier of industrial diamond & cBN manufacturing
Harmony Industry Diamond (H.I.D.)
| Place of Origin: | Zhengzhou China (Mainland) |
|---|---|
| Brand Name: | Harmony |
| Certification: | ISO 9001:2015, SGS |
| Model Number: | HID PD |
| Minimum Order Quantity: | 100 Carat |
| Price: | Negotiable |
| Packaging Details: | Plastic Bag, Bottle |
| Delivery Time: | 3-5 days |
| Payment Terms: | T/T, L/C, Western Union, MoneyGram, Paypal |
| Supply Ability: | 15,000,000 Carats per year |
| Model: | HID PD | Size Available: | 0-1um To 8-12um |
|---|---|---|---|
| Material: | Diamond | Classification Of Diamond: | Synthetic |
| Shape: | Polycrystalline | Production Method: | Detonation |
| Hardness: | Superabrasives | Raw Material: | ZhongNan |
| Color: | Black | Characteristic: | High Purity |
| Particle: | Grit, Dust | Function: | Surface Polishing |
| Usage: | Ultra-precision Grinding And Polishing | Application: | Sapphire Wafer |
| Source: | Precision Abrasives | Shipment: | DHL |
| HS Code: | 7105102000 | OEM/ODM: | Available |
| High Light: | 10 micron Poly Diamond Powder,Poly Diamond Powder for silicon wafers,0.1 micron Diamond Powder |
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Black 0.1 to 10 micron Poly Diamond Powder for silicon wafers
Description:
Based on the polycrystalline diamond powder synthesized by the explosive method, after the company's specific secondary shaping technology, precise precision classification, strict impurity treatment and other processes, the product obtained has a narrow particle size range, high purity, and effective grinding Lots of particles. Detected by the laser particle size detector, the actual powder particle size distribution is between 0.1 microns and 10 microns.
It can be widely used in the processing of silicon wafers in the IT industry; the precision processing of red and sapphire; the processing of precision ceramics; the processing of optical lenses; the processing of optical fiber communications.
Available Sizes of Polycrystalline Diamond Powder:
| Range | 0-1 | 1-2 | 1-3 | 2-4 | 2-5 | 3-6 | 3-7 | 4-8 | 5-10 | 6-12 | 8-12 |
| HID PD | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ |
Particle Size Distribution Specification for Superabrasive Grains
| Size | D10≥(µm) | D50(µm) | D95≤(µm) | Max(µm) | Min(µm) |
| 0-0.25 | 0.1 | 0.170~0.210 | 0.38 | -- | -- |
| 0-0.5 | 0.12 | 0.220~0.280 | 0.51 | --- | -- |
| 0-1 | 0.42 | 0.501~0.580 | 0.795 | 1.156 | 0.375 |
| 0.5-1 | 0.472 | 0.581~0.690 | 1.053 | 1.375 | 0.375 |
| 0.5-1.5 | 0.504 | 0.691~0.871 | 1.298 | 1.945 | 0.375 |
| 0-2 | 0.62 | 0.872~0.985 | 1.542 | 2.312 | 0.446 |
| 1/2 | 0.761 | 0.986~1.224 | 1.894 | 3.27 | 0.63 |
| 0.5-3 | 0.94 | 1.225~1.487 | 2.401 | 3.889 | 0.63 |
| 1/3 | 1.048 | 1.488~1.712 | 2.882 | 4.625 | 0.75 |
| 1.5-3 | 1.169 | 1.713~2.014 | 3.321 | 5.5 | 0.75 |
| 2/3 | 1.392 | 2.015~2.302 | 3.663 | 6.541 | 0.892 |
| 2/4 | 1.644 | 2.303~2.754 | 4.496 | 7.778 | 0.892 |
| 2/5 | 1.803 | 2.755~3.312 | 5.5 | 9.25 | 1.06 |
| 3/6 | 2.448 | 3.313~3.898 | 6.386 | 11 | 1.499 |
| 3/7 | 2.913 | 3.899~4.676 | 7.566 | 13.08 | 1.783 |
| 4/8 | 3.605 | 4.677~5.400 | 8.455 | 15.56 | 2.121 |
| 4/9 | 3.952 | 5.401~6.062 | 9.762 | 18.5 | 2.522 |
| 5/10 | 4.401 | 6.063~6.700 | 10.98 | 18.5 | 2.999 |
| 5/12 | 5.022 | 6.701~7.673 | 12.95 | 22 | 3.566 |
| 6/12 | 5.807 | 7.674~8.549 | 13.97 | 26.16 | 4.241 |
| 7/14 | 6.411 | 8.550~9.483 | 15.13 | 26.16 | 4.241 |
| 8/16 | 7.113 | 9.484~10.78 | 17.82 | 31.11 | 5.044 |
| 8/20 | 8.102 | 10.79~12.56 | 20.6 | 37 | 5.998 |
| 10/20 | 9.186 | 12.57~14.18 | 22.54 | 37 | 7.133 |
| 12/22 | 10.53 | 14.19~16.05 | 24.41 | 44 | 7.133 |
| 12/25 | 12.01 | 16.06~17.65 | 26.61 | 44 | 8.482 |
| 15-25 | 13.32 | 17.66~19.55 | 29.75 | 52.33 | 10.09 |
| 20-30 | 15.04 | 19.56~22.50 | 34.64 | 62.23 | 12 |
| 22-36 | 17.28 | 22.51~26.12 | 39.98 | 74 | 12 |
| 30-40 | 20.11 | 26.13~30.10 | 46.56 | 88 | 14.27 |
| 30-50 | 22.36 | 30.11~34.58 | 52.87 | 88 | 16.96 |
| 36-54 | 25.68 | 34.59~39.00 | 60.94 | 104.7 | 20.17 |
| 40-60 | 29.45 | 39.01~43.20 | 69.86 | 124.5 | 20.17 |
| 50-70 | 32.42 | 43.21~47.50 | 72.65 | 124.5 | 23.99 |
| 54-80 | 36.56 | 47.51~52.50 | 80.74 | 124.5 | 23.99 |
Feature:
Tight, customized particle size distribution
Blocky and rough particle surface
Stringent oversize control
Low scratch count
Self-sharpening with high material removal rate
Characteristics:
- Detonation synthetic polycrystalline diamond micropowder has the expensive and rare polycrystalline structure of black natural diamond, which is dark gray, metallic luster, good toughness, and has the characteristics of automatic cutting edge.
- Compared with impact synthetic static pressure or natural single crystal diamond, silicon oxide, corundum and other abrasive materials, the grinding efficiency of polycrystalline diamond is 2 to 4 times higher.
- The grinding precision of polycrystalline diamond is unprecedentedly improved.
A. When using 2～4μm polycrystalline diamond powder to grind the workpiece, R<1.6nm.
B. When using 0～0.5μm polycrystalline diamond powder to grind the workpiece, Ra=1.3～1.4nm
C. When using 0～0.125μm polycrystalline diamond powder to grind the workpiece, Ra<0.1nm
D. Due to the "ball" shape of the polycrystalline diamond surface, no scratches will be left on the surface of the workpiece to be polished, thereby improving the polishing yield.
E. Polycrystalline diamond powder can also be plated on the inner wall of a workpiece (such as a cylinder) through an electroless plating method, and its wear resistance is better than any other material.
Application for Polycrystalline Diamond Powder HID PD:
- Polishing sapphire, silicon, ceramics, metals, etc.
- Processing of magnetic head materials, antimagnetic films (MR), multilayer films, sputtering films, molecular beam epitaxy (MBE), ferrite and printing plates.
- Processing fiber optic connectors, laser rods and other products that require certain light waves to pass through.
Workpieces Processing
- Silicon wafers, monocrystalline and polycrystalline silicon, semiconductor wafers, photovoltaic wafers
- Sapphire phone screen, sapphire mobile phone screen saver, camera sapphire screen protective film
- Sapphire mobile phone camera protective film, mobile phone cover glass, sapphire watch mirror
- Precision cemented carbide, precision ceramics, optical glass and lens, etc.
