Global Supplier of industrial diamond & cBN manufacturing
Harmony Industry Diamond (H.I.D.)
| Place of Origin: | Zhengzhou China (Mainland) |
|---|---|
| Brand Name: | Harmony |
| Certification: | ISO 9001:2015, SGS |
| Model Number: | HID PD |
| Minimum Order Quantity: | 100 Carat |
| Price: | Negotiable |
| Packaging Details: | Plastic Bag, Bottle |
| Delivery Time: | 3-5 days |
| Payment Terms: | T/T, L/C, Western Union, MoneyGram, Paypal |
| Supply Ability: | 15,000,000 Carats per year |
| Model: | HID PD | Sizes: | 0-1um To 8-12um |
|---|---|---|---|
| Material: | Diamond | Abrasive Type: | Synthetic Diamond |
| Crystal Shape: | Polycrystalline | Production Method: | Ultra Detonated |
| Hardness: | Superabrasives | Raw Material: | ZhongNan Company |
| Color: | Black | Shape: | More Crystal Edge |
| Particle Size: | Dust | Function: | Surface Finish |
| Usage: | Lapping And Superfine Polishing | Application: | Sapphire Wafer And Semiconductor |
| Source: | Artificial Abrasives | Shipment: | FedEx |
| HS Code: | 71051020.00 | OEM/ODM: | Available |
| High Light: | Detonated diamond lapping powder,8 12um diamond lapping powder,1um diamond abrasive powder |
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0-1um to 8-12um Detonated Diamond Lapping Powder for Semiconductor
Description:
Polycrystalline diamond, is synthesized by detonation method. The color is grayish black, slightly metallic; It is composed of nano-crystallites that give it a unique break down mechanism, which allows new cutting edges to be exposed creating a self-sharpening characteristic. In the application, nano-crystallites break down gradually, resulting in more crystal edges and grinding surfaces. Therefore, polycrystalline diamond has the characteristics of high removal rate, self-sharpening and high toughness, which not only ensures the surface finish of workpieces, but also improves the grinding efficiency, it shows its unique superiority in the processing of some high quality products.
Available Sizes of Polycrystalline Diamond Powder:
| Range | 0-1 | 1-2 | 1-3 | 2-4 | 2-5 | 3-6 | 3-7 | 4-8 | 5-10 | 6-12 | 8-12 |
| HID PD | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ |
Particle Size Distribution Specification for Superabrasive Grains
| Size | D10≥(µm) | D50(µm) | D95≤(µm) | Max(µm) | Min(µm) |
| 0-0.25 | 0.1 | 0.170~0.210 | 0.38 | -- | -- |
| 0-0.5 | 0.12 | 0.220~0.280 | 0.51 | --- | -- |
| 0-1 | 0.42 | 0.501~0.580 | 0.795 | 1.156 | 0.375 |
| 0.5-1 | 0.472 | 0.581~0.690 | 1.053 | 1.375 | 0.375 |
| 0.5-1.5 | 0.504 | 0.691~0.871 | 1.298 | 1.945 | 0.375 |
| 0-2 | 0.62 | 0.872~0.985 | 1.542 | 2.312 | 0.446 |
| 1/2 | 0.761 | 0.986~1.224 | 1.894 | 3.27 | 0.63 |
| 0.5-3 | 0.94 | 1.225~1.487 | 2.401 | 3.889 | 0.63 |
| 1/3 | 1.048 | 1.488~1.712 | 2.882 | 4.625 | 0.75 |
| 1.5-3 | 1.169 | 1.713~2.014 | 3.321 | 5.5 | 0.75 |
| 2/3 | 1.392 | 2.015~2.302 | 3.663 | 6.541 | 0.892 |
| 2/4 | 1.644 | 2.303~2.754 | 4.496 | 7.778 | 0.892 |
| 2/5 | 1.803 | 2.755~3.312 | 5.5 | 9.25 | 1.06 |
| 3/6 | 2.448 | 3.313~3.898 | 6.386 | 11 | 1.499 |
| 3/7 | 2.913 | 3.899~4.676 | 7.566 | 13.08 | 1.783 |
| 4/8 | 3.605 | 4.677~5.400 | 8.455 | 15.56 | 2.121 |
| 4/9 | 3.952 | 5.401~6.062 | 9.762 | 18.5 | 2.522 |
| 5/10 | 4.401 | 6.063~6.700 | 10.98 | 18.5 | 2.999 |
| 5/12 | 5.022 | 6.701~7.673 | 12.95 | 22 | 3.566 |
| 6/12 | 5.807 | 7.674~8.549 | 13.97 | 26.16 | 4.241 |
| 7/14 | 6.411 | 8.550~9.483 | 15.13 | 26.16 | 4.241 |
| 8/16 | 7.113 | 9.484~10.78 | 17.82 | 31.11 | 5.044 |
| 8/20 | 8.102 | 10.79~12.56 | 20.6 | 37 | 5.998 |
| 10/20 | 9.186 | 12.57~14.18 | 22.54 | 37 | 7.133 |
| 12/22 | 10.53 | 14.19~16.05 | 24.41 | 44 | 7.133 |
| 12/25 | 12.01 | 16.06~17.65 | 26.61 | 44 | 8.482 |
| 15-25 | 13.32 | 17.66~19.55 | 29.75 | 52.33 | 10.09 |
| 20-30 | 15.04 | 19.56~22.50 | 34.64 | 62.23 | 12 |
| 22-36 | 17.28 | 22.51~26.12 | 39.98 | 74 | 12 |
| 30-40 | 20.11 | 26.13~30.10 | 46.56 | 88 | 14.27 |
| 30-50 | 22.36 | 30.11~34.58 | 52.87 | 88 | 16.96 |
| 36-54 | 25.68 | 34.59~39.00 | 60.94 | 104.7 | 20.17 |
| 40-60 | 29.45 | 39.01~43.20 | 69.86 | 124.5 | 20.17 |
| 50-70 | 32.42 | 43.21~47.50 | 72.65 | 124.5 | 23.99 |
| 54-80 | 36.56 | 47.51~52.50 | 80.74 | 124.5 | 23.99 |
Feature:
Tight, customized particle size distribution
Blocky and rough particle surface
Stringent oversize control
Low scratch count
Self-sharpening with high material removal rate
Characteristics:
Round particle shape, no irregular shapes like pencils or flakes.
Oversizes completely removed.
Narrow PSD.
Surface purity can reach ppm level.
Outstanding dispersibility.
Application for Polycrystalline Diamond Powder HID PD:
Polycrystalline diamond is primarily for high-performance grinding and polishing process. It can be widely used for grinding and polishing of silicon wafer, ruby, sapphire, optical lens, metallographic sample, optical fiber communication and ceramics in IT industry, as well as disc modification, magnetic head polishing and substrate grinding.
Lapping and polishing of semiconductor wafers such as SiC and sapphire wafers
Surface polishing of various ceramics
Surface treatment of metals, such as stainless steel and aluminium alloy.
Workpieces Processing
- Silicon wafers, monocrystalline and polycrystalline silicon, semiconductor wafers, photovoltaic wafers
- Sapphire phone screen, sapphire mobile phone screen saver, camera sapphire screen protective film
- Sapphire mobile phone camera protective film, mobile phone cover glass, sapphire watch mirror
- Precision cemented carbide, precision ceramics, optical glass and lens, etc.
